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Electronic process of Cu(Ag, V, Rh)-(001) surface oxidation: atomic valences and bonding kinetics
Sun Changqing * #
Nayang Technological University
*Correspondence author
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Funding: none
Opened online: 9 August 2005
Accepted by: none
Citation: Sun Changqing.Electronic process of Cu(Ag, V, Rh)-(001) surface oxidation: atomic valences and bonding kinetics[OL]. [ 9 August 2005] http://en.paper.edu.cn/en_releasepaper/content/2631
 
 
The electronic processes of Cu(Ag, V, Rh)(001) surface oxidation are comparatively analyzed based on the recent ‘chemical bond – valence band – potential barrier’ (BBB) correlation mechanism [C. Q. Sun, Prog. Mater. Sci. 48, 521-685 (2003)], which allows reaction formulae for all the observed phases with identification of individual atomic valence and the binding kinetics at the surfaces with the same geometry. It is consistently understood that the forming kinetics of the primary oxide tetrahedron and its derivative on the valence density-of-states are intrinsically common for all these analyzed systems, though the patterns of observation in terms of morphology and crystallography vary from situation to situation. However, the lattice size and electronegativity of the host surfaces determine extrinsically the site selectivity of the oxygen, the order of bond formation and the orientation of the oxide tetrahedron.
Keywords:chemical bond; valence band; surface potential; Cu; Ag; V; Rh; oxygen; oxidation; reaction kinetics; scanning tunneling microscopy; LEED; PES
 
 
 

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