Cu3O2 pairing tetrahedron at Cu(001) surface: aging and relaxation

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Sun Changqing * #

Nanyang Technological University

*Correspondence author

#Submitted by

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Funding: none

Opened online: 6 September 2005

Accepted by: none

Citation: Sun Changqing.Cu3O2 pairing tetrahedron at Cu(001) surface: aging and relaxation[OL]. [ 6 September 2005] http://en.paper.edu.cn/en_releasepaper/content/2802

It is shown that the Cu3O2 paring tetrahedron formed at Cu(001) surface will suffer dehybridization under annealing.

Keywords:LEED, chemisorption, bondig

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