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Evaluation of the Chip-level Thermal Uniformity for Semiconductor Devices
ZHANG Guangchen 1 * #,FENG Shiwei 2,LI Jingwan 2,LIU Jing 2,ZHOU Zhou 2
1.School of Electronic Information& Control Engineering, Beijing University of Technology
2.School of Electronic Information& Control Engineering, Beijing University of Technology, Beijing, 100124, CHINA
*Correspondence author
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Funding: The Specialized Research Fund for the Doctoral Program of Higher Education of China (No.Grant No.20091103110006), and the 9th Science and Technology Postgraduate Foundation of Beijing University of Technology)
Opened online:15 June 2011
Accepted by: none
Citation: ZHANG Guangchen,FENG Shiwei,LI Jingwan.Evaluation of the Chip-level Thermal Uniformity for Semiconductor Devices[OL]. [15 June 2011] http://en.paper.edu.cn/en_releasepaper/content/4431958
 
 
In this paper, a method to evaluate the chip-level thermal uniformity of semiconductor devices by electrical transient thermal response testing is proposed. It's found that the degree of the chip's thermal non-uniformity presents a monotonic increasing relationship with the height of the first step of heating response curves. This phenomenon is observed both in a 3-dimensional transient thermal simulation based on the finite element method (FEM) and transient thermal measurements by electrical temperature sensitive parameter (TSP) method. Chip's surface temperature distributions under different current distributions are also measured by infrared image method and the thermal spectrum method is adopted to analyze the temperature non-uniformity quantitatively. The relationship between the degree of temperature non-uniformity and current distribution is consistent with the result of our proposed method.
Keywords:Thermal non-uniformity; heating response curve; thermal spectrum; reliability
 
 
 

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