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Evaluation of the Chip-level Thermal Uniformity for Semiconductor Devices |
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ZHANG Guangchen 1 * #,FENG Shiwei 2,LI Jingwan 2,LIU Jing 2,ZHOU Zhou 2
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1.School of Electronic Information& Control Engineering, Beijing University of Technology
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2.School of Electronic Information& Control Engineering, Beijing University of Technology, Beijing, 100124, CHINA
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*Correspondence author |
#Submitted by |
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Subject: |
Funding:
The Specialized Research Fund for the Doctoral Program of Higher Education of China (No.Grant No.20091103110006), and the 9th Science and Technology Postgraduate Foundation of Beijing University of Technology) |
Opened online:15 June 2011 |
Accepted by:
none |
Citation: ZHANG Guangchen,FENG Shiwei,LI Jingwan.Evaluation of the Chip-level Thermal Uniformity for Semiconductor Devices[OL]. [15 June 2011] http://en.paper.edu.cn/en_releasepaper/content/4431958 |
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