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A Novel Fast and Effective Hierarchical Thermal-Aware Floorplanning Algorithm
Pingjie Cheng * #,Ning Xu
Wuhan University of Technology
*Correspondence author
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Funding: 国家自然科学基金（No.Grant No. 60572015）
Opened online:24 February 2009
Accepted by: none
Citation: Pingjie Cheng,Ning Xu.A Novel Fast and Effective Hierarchical Thermal-Aware Floorplanning Algorithm[OL]. [24 February 2009] http://en.paper.edu.cn/en_releasepaper/content/29596
 
 
Hierarchical approaches are employed in current floorplanning algorithms for scaling to large number modules. With the development of VLSI technology, the thermal problem has been emerged as one of the key issues for IC design. In this paper, we propose a novel power density clustering method to guide the optimization of floorplanning, which aims to efficiently reduce the hotspots while optimizing design metrics such as area and total wirelength.The experimental results with GSRC benchmarks show that the thermal effect is well controlled so that the temperature of ”hot spots” has decreased on the chip. Our algorithm is compared with the state-of-the-art thermal-aware floorplanning algorithm Hotspot Floorplan, it can reduce the max temperature by 3% while saving time by about 300%.
Keywords:Fast; Effective; Hierarchical; Thermal-Aware
 
 
 

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