Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation

GE Daohan

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Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation

GE Daohan * #

School of Engineering, Jiangsu University, Zhenjiang, 212013

*Correspondence author

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Funding: natural science foundation of Jiangsu province youth foundation （No.BK20140556）, the specialized research fund for the doctoral program of higher education of China （No.No. 20133227120022）, the national natural science foundation of China （No.No.11404146）

Opened online: 2 May 2017

Accepted by: none

Citation: GE Daohan.Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation[OL]. [ 2 May 2017] http://en.paper.edu.cn/en_releasepaper/content/4729420

The interfacial thermal conductivity of Aluminum/Copper interface is systematic studied based on non-equilibrium molecular dynamics (NEMD) method by considering the atomic migration and atomic weight under different temperatures. An interesting phenomenon is discovered that the interfacial thermal conductivity is effect by the atomic weight of each materials. The thermal conductivity of the materials with small atomic weight is larger than that of the materials with large atomic weight in the interface heat transfer. The contribution of aluminum and copper to the interface thermal conductivity is inversely proportional. This investigation is helpful for understanding the interface heat transfer mechanism of the interface structures, which also implies a potential method for the analysis of the interface thermal performance and design of the interface structures.

Keywords:Semiconductor devices and technology; Composite Interface; Interface thermal conductivity

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