| |
| Micro-scratch is a major defect for oxide CMP(including STI/ILD/IMD CMP), serious micro-scratch would form W Puddle, which will make metal short and then cause yield loss. So far no robust method can avoid this issue. Based on P-FMEA theory, do improvement at severity, detection and occurrence three aspects: add process time at post WCMP to decrease micro-scratch impact, making a robust monitor control method to robust detect this issue early and study a method to decreasing the occurrence of this issue. By all of the efforts, Micro-scratch issue at CMP process has much improvement. |
|
| Keywords:CMP;Micro-scratch;P-FMEA |
|
