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Micropackaging of Al2O3 Shell on the Surface of Al-Si Eutectic Alloy Phase Change Materials
HE Fei 1 *,SUN Yongchang 2,LI Mingwei 3,SHI Liping 2,HE Xiaodong 2
1.National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology
2.National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, 150080
3.School of Materials Science and Engineering, Harbin Institute of Technology, 150001
*Correspondence author
#Submitted by
Subject:
Funding: Specialized Research Fund for the Doctoral Program of Higher Education. (No.No. 20070213059), National Natural Science Foundation of China)
Opened online:23 February 2011
Accepted by: none
Citation: HE Fei,SUN Yongchang,LI Mingwei.Micropackaging of Al2O3 Shell on the Surface of Al-Si Eutectic Alloy Phase Change Materials[OL]. [23 February 2011] http://en.paper.edu.cn/en_releasepaper/content/4408564
 
 
Al-Si alloy is an ideal phase change material because of its high latent heat and can be introduced into insulation material acting on preventing thermal transfer. But when Al-Si alloy begins phase change, it will become to liquid from solid. So it is necessary to prepare ceramic films on Al-Si alloy surface in order to stop liquid flow. In this work, the core-shell particles with a certain thickness of films were obtained by packaging Al-Si eutectic alloy powders (Al-87.48%, Si-12.05%) by the means of sol-gel. At room temperature, Al-Si alloy was covered with a layer of 2 to10 nm oxide films. When the temperature reached or closed to the melting point, the oxide thickness of oxide films would be up to 200 nm. Repeatedly burned, the oxidation rate of Al-Si alloy was less than 0.01%. After long time heat-treatment (20h) below melting temperature (580℃), Al-Si alloy powders were coated with alumina films by hydrolyzing aluminium isopropoxide. It was found that the thickness of alumina films would reach 1 to 3 μm and form core-shell particles on the Al-Si alloy powder surface after repeatedly dipping. At high temperature (>900℃), the alumina films did not rupture and liquid balls did not appear. In addition, the particles kept good thermal conduction properties.
Keywords:Al-Si alloy;Al2O3 shell;sol-gel;phase change materials
 
 
 

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