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Boron nitride/Cyanate ester composite materials with enhanced thermal conductivity
Qian Chen,Rongfeng Ni,Hui Li,Mingsong Duan,Xifeng Ding *
School of Materilas Science and Enginerring, Nanjing University of Science and Technology, No 200 Xiaolingwei Street, Nanjing, Jiangsu 210094, PR
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Funding: National Nature Science Foundation of China （No.No. 11134004）, Jiangsu Key Laboratory of Advanced Micro & Nano Materials and Technology in NUST（No.No. AE89503）
Opened online:25 October 2016
Accepted by: none
Citation: Qian Chen,Rongfeng Ni,Hui Li.Boron nitride/Cyanate ester composite materials with enhanced thermal conductivity[OL]. [25 October 2016] http://en.paper.edu.cn/en_releasepaper/content/4705589
 
 
Dielectric polymer composites with high thermal conductivity are very attractive for thermal management application in advanced packing materials. High thermal conductivity as well as low dielectric constant and dielectric loss of the composites are desirable simultaneously to be achieved although they are usually a paradox. Here, an ideal dielectric thermally conductive cyanate ester resin (CE) composite is fabricated using modified boron nitride (BN) as fillers. The thermal conductivity, electrical insulating performance, mechanical performance and fractural morphology of the composites have been systematically investigated. The composites with 25 wt% fraction of KH550 modified BN exhibit much high thermal conductivity, i.e., 0.84W m-1 k-1 at room temperature, which is 4 times higher than baseline resin materials. Moreover, the thermal stability of the composites has been improved from about 375 C to 425 C. Though the dielectric constant and dielectric loss were somewhat increased for the composite with BN addition, the composite materials still remain good electrical insulating property. The advantages of the prepared BN/CE composites are attributed to the excellent intrinsic properties of BN, carefully developed preparation process and effective surface modification by KH550 coupling agent.
Keywords:Composite materials; Boron nitride; Cyanate ester; High thermal conductivity.
 
 
 

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