Advanced backend process of CMOS image sensor

Fan Yangyang

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Advanced backend process of CMOS image sensor

Fan Yangyang *

Shanghai Huali Microelectronics Corporation

*Correspondence author

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Funding: none

Opened online:30 March 2018

Accepted by: none

Citation: Fan Yangyang.Advanced backend process of CMOS image sensor[OL]. [30 March 2018] http://en.paper.edu.cn/en_releasepaper/content/4743710

This paper improved backend process of CMOS image sensor (CIS) which developed from 55nm CMOS manufacturing process in order to improve the imaging results. There are two implementation methods: One is adding deep trench process (DT) after the aluminum process (AL).The other is adding NDC(nitride doped carbon) Remove process after the deposition of NDC of every metal layer. Both methods can form the optical channel and achieve the requirements of devices.

Keywords:CIS, Advance Process, 4T, Deep trench process, NDC

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