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Effects of Substrate Properties on the Calculated Mechanical Properties of Film/Substrate Systems by Nanoindentation
Yanguo Liao 1 #,Heping Hu 1,Yichun Zhou 2 *,Limei Jiang 3
1.Faculty of Mathematics and Physics, University of South China, Hunan 421001, China
2.Faculty of Materials, Optoelectronics and Physics
3.College of Packing & Printing, Hunan University of Technology, Hunan 412007, China
*Correspondence author
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Funding: none
Opened online: 6 November 2008
Accepted by: none
Citation: Yanguo Liao,Heping Hu,Yichun Zhou.Effects of Substrate Properties on the Calculated Mechanical Properties of Film/Substrate Systems by Nanoindentation[OL]. [ 6 November 2008] http://en.paper.edu.cn/en_releasepaper/content/25487
 
 
In this paper, the conical nanoindentation on an elastic-plastic film bonded to an elastic-plastic substrate has been systematically investigated with finite element (FE) method. The mechanical responses of the combination of different film/substrate material systems to the maximum indentation depth have been obtained by changing the ratio between the maximum depth and thin-film thickness, hm/t, from 0.01 to 1.25 and by comparing FE analysis results with the corresponding bulk materials’ mechanical responses. The effect of substrate mechanical properties on the calculated mechanical properties of film/substrate systems and the indentation contact depth have been investigated for different film/substrate systems.
Keywords:Elastic-plastic;Finite element method;Film/substrate material system
 
 
 

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