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Sponsored by the Center for Science and Technology Development of the Ministry of Education
Supervised by Ministry of Education of the People's Republic of China
In semiconductor manufacturing, the process of wafer fabrication is arguably the most technologically complex and capital intensive stage. This large-scale discrete-event process is highly re-entrant with hundreds of machines and processing steps. These optimization problems fall into the class of NP-hard problems. This paper addresses an optimized approach for the re-entrant flow shop scheduling problem (RFSP) by using genetic algorithm (GA). An effective mutation method with range restriction is proposed to minimize total turn around time (TTAT), especially dealing with the accidents effectively when re-scheduling is needed. Then we compare the modified genetic method with local search method and FIFO method. Experimental results indicated that the proposed method can efficiently balance the population variety and computing rate.