Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine

Gu Changdong; You Y. H.; Wang X. L.; Tu J. P.

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Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine

Gu Changdong 1 * #,You Y. H. 2,Wang X. L. 2,Tu J. P. 2

1.Department of Materials Science and Engineering, Zhejiang University, HangZhou 310025

2.Department of Materials Science and Engineering, Zhejiang University

*Correspondence author

#Submitted by

Subject:

Funding: Specialized Research Fund for the Doctoral Program of Higher Education of China （No.20100101120026）, National Natural Science Foundation of China （No.51001089,51271169）

Opened online: 5 September 2012

Accepted by: none

Citation: Gu Changdong,You Y. H.,Wang X. L..Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine[OL]. [ 5 September 2012] http://en.paper.edu.cn/en_releasepaper/content/4487953

A comparative study was carried out on the deposition mechanism, microstructure, and corrosion resistance of Cu films electrodeposited from the base electrolyte of CuCl2?2H2O in a choline chloride ─ethylene glycol eutectic solvent with absence and presence of the additive of ethylene diamine (EDA). The base electrolyte is unstable and produces rough Cu films with columnar grains. Upon the introduction of EDA, the modified electrolyte becomes stable and the nucleation of Cu deposits is strongly inhibited, thus producing a smooth and compact surface with finer grains. Uniform corrosion and decreased corrosion current density are recognized in the fine grained Cu films.

Keywords:Electrodeposition; Ionic liquids; Copper; Additive; Corrosion resistance

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