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1. Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation | |||
GE Daohan | |||
Electrics, Communication and Autocontrol Technology 25 April 2017 | |||
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Abstract:The interfacial thermal conductivity of Aluminum/Copper interface is systematic studied based on non-equilibrium molecular dynamics (NEMD) method by considering the atomic migration and atomic weight under different temperatures. An interesting phenomenon is discovered that the interfacial thermal conductivity is effect by the atomic weight of each materials. The thermal conductivity of the materials with small atomic weight is larger than that of the materials with large atomic weight in the interface heat transfer. The contribution of aluminum and copper to the interface thermal conductivity is inversely proportional. This investigation is helpful for understanding the interface heat transfer mechanism of the interface structures, which also implies a potential method for the analysis of the interface thermal performance and design of the interface structures. | |||
TO cite this article:GE Daohan. Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation[OL].[25 April 2017] http://en.paper.edu.cn/en_releasepaper/content/4729420 |
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