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1. Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation | |||
GE Daohan | |||
Electrics, Communication and Autocontrol Technology 25 April 2017 | |||
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Abstract:The interfacial thermal conductivity of Aluminum/Copper interface is systematic studied based on non-equilibrium molecular dynamics (NEMD) method by considering the atomic migration and atomic weight under different temperatures. An interesting phenomenon is discovered that the interfacial thermal conductivity is effect by the atomic weight of each materials. The thermal conductivity of the materials with small atomic weight is larger than that of the materials with large atomic weight in the interface heat transfer. The contribution of aluminum and copper to the interface thermal conductivity is inversely proportional. This investigation is helpful for understanding the interface heat transfer mechanism of the interface structures, which also implies a potential method for the analysis of the interface thermal performance and design of the interface structures. | |||
TO cite this article:GE Daohan. Numerical Investigation on the Relationship between the Atomic Weigh and the Interface Thermal Conductivity of Aluminum/Cooper Composite Interface in Nanoscale Situation[OL].[25 April 2017] http://en.paper.edu.cn/en_releasepaper/content/4729420 |
2. The parasitic in analog design | |||
Hu Lin | |||
Electrics, Communication and Autocontrol Technology 09 June 2013 | |||
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Abstract:Since parasitic exists everywhere. If you did not pay more attention to the parasitic or even neglect it , the parasitic will kill your design, typically, in the analog design. Through the analysis of the circuit and the cross-section, we can find that sometimes the design circuit is not really what you want. Also, one device, if the connection in the opposite direction, the result is completely different. But parasitic is not harmful without a benefit , sometimes we can make good use of it. In order to reduce risk in the circuit and improve the quality, we should find out the potential parasitic, then work out the solution. | |||
TO cite this article:Hu Lin. The parasitic in analog design[OL].[ 9 June 2013] http://en.paper.edu.cn/en_releasepaper/content/4543806 |
3. Design of LNA and improved active dual balanced mixer for 802.11a WLAN | |||
Wu Zhongjie,Zhao Liang,Zhu Yufeng,Shen Yi,Huang Fengyi | |||
Electrics, Communication and Autocontrol Technology 14 April 2008 | |||
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Abstract:This paper represents a simple prescription of LNA and improved new active dual balanced mixer for 802.11a WLAN with 0.18um CMOS technology. The conversion voltage gain of the LNA achieves 14.8dB, S11 is -20.8dB, S22 is -23.1dB and noise figure is 1.38dB, as shown in the simulation results with 1.8 V supply voltage at 5.8GHz, respectively. The power dissipation is 26.3mW. The die size of the LNA is 0.9mm*0.67mm. The RF, LO and IF frequency applied to the mixer are 5.8 GHz, 4.6 GHz and 1.2 GHz, respectively. This mixer achieves a conversion gain of -2.4dB, as well as a single-sideband noise figure (SSB NF), 1dB compression point, third-order input intercept point(IIP3) and power consumption of 12.1dB, 3.68dBm, 12.78dBm and 22.3mW at 5.8GHz, respectively. The die size of the mixer is 1.4mm*1.1mm. | |||
TO cite this article:Wu Zhongjie,Zhao Liang,Zhu Yufeng, et al. Design of LNA and improved active dual balanced mixer for 802.11a WLAN[OL].[14 April 2008] http://en.paper.edu.cn/en_releasepaper/content/20458 |
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